ABSTRACT
The influence of vapour diffusion on the drying rate of a softwood board has been examined for drying temperatures varying from 60°C to 140°C. It is found that for very low temperature drying a model which considers both vapour convective and diffusion in wood predicts dry-rate curves matching the experimental data closely. For high temperature drying, both of the above drying model and a drying model which considers only vapour convective flow give predictions in agreement with the observed data. This illustrates that the diffusion of vapour and air is important in low temperature drying panicularly during the late stages of drying. However, for high temperature drying, the convective flow of moisture vapour is dominant and the diffusion component is negligible. The observation provides evidence for simplifying a drying model for high temperature drying without reducing its credibility in predicting drying rate curves.