FABRICATION AND CHARACTERIZATION OF FULLY EMBEDDED DIPLEXER AND BAND-PASS FILTERS FOR ORGANIC RF SOP APPLICATIONS

ABSTRACT

In this paper, fully embedded dual-band WLAN diplexer, 2.4 GHz WLAN BPF and wide-band pass filter are investigated into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded passive components were designed and analyzed by using ADS circuit simulator and CST 3D EM simulator for verifying their applicability. The fabricated diplexer and filters are the smallest one of the filters formed onto the organic substrate. The diplexer has a size of 3 mm × 2.5 mm × 0.77 mm and exhibits an insertion loss of max −0.68 dB in 2.4 ∼ 2.5 GHz band and max –3 dB in 5.15 ∼ 5.32 GHz band, respectively. The 2.4 GHz BPF has a size of 2.7 mm × 2.1 mm × 0.77 mm and exhibits an insertion loss of max −2.7 dB. The WBPF has a size of 3.2 mm × 2.5 mm × 0.77 mm and exhibits an insertion loss of −2.65 dB. The major benefit of these embedded passive components, compared to a discrete solution, is a significant simplification and size/volume reduction of RF systems design.

Keywords:

• Embedded passives
• PCB
• WLAN
• diplexer
• BPF
• SOP (System on a package)
• High dielectric composite MIM capacitor
• Spiral inductor
• High quality factor

ACKNOWLEDGMENTS

This research was partially supported by SRC/ERC program of MOST/KOSEF (Intelligent Radio Engineering Center) and the Seoul Research and Business Development Program (Grant No.10583). Simulation was performed by using CST Studio Suite 2006. Fabrication was carried out at the DaeDuck Electronics in Korea. The authors thanks to MiNDaP group members for their technical supports and discussions.