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Abstract
The kind of bonding phase has a significant influence on the microstructure and mechanical properties of diamond compacts. Microstructural studies of diamond with 5% wt. Ti and 5%wt. Tic (and also 30%wt. Tic) were carried out with a Transmission Electron Microscope. The TEM microstructural observations show differences between the metal and metal carbide bonding phase in diamond compacts. The mismatch of thermal expansion coefficients between diamond and the bonding metal or the compound induces significant internal stresses and may generate micro-cracks in polycrystalline diamond compacts. Twins and dislocations are the important details of microstructures in diamond crystals after HPHT sintering. They can appear as a result of residual stress relaxation. Results of measurements of residual stresses on a diamond compact surface by means of the “sin2ψ X-ray diffraction method are reported.