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Abstract
A novel structure of the waveguide-to-microstrip transition of a Ka band is presented using low-temperature co-fired (LTCC) technology. The slot coupling between the waveguide and microstrip, as well as the grid-like conductive sidewalls in the LTCC multilayer substrates are introduced. Five resonant patches and two impedance transformation sections are used to improve the bandwidth and performance of the transition. An improved transition is designed and fabricated in an LTCC substrate. The simulated and measured results show good performances. The experimental results of improved transition show that the return loss and the insertion loss are better than 14 and 1.35 dB, respectively, in the frequency range from 31.05 to 38.85 GHz.
Acknowledgement
This work was supported by the National Natural Science Foundation of China (Grant No. 61006026).