ABSTRACT
Experimental and theory investigations on the effects of single-phase (PyC) and co-deposited (PyC+SiC) interphases on the mechanical properties of T700TM-C/SiC minicomposites were conducted. Monotonic tensile tests and fiber’s push-in tests were conducted to obtain the minicomposite’s macro tensile mechanical properties and micro interface properties. The tensile strength was analyzed via a two-parameter Weibull distribution. The failure mechanism was obtained by fiber’s push-in tests and characterized by fracture morphology, and a damage-based micromechanical constitutive model was adopted to predict the tensile stress-strain response and interface debonding ratio (η) of C/SiC minicomposites with different interphases. For C/SiC, the experimental tensile curves were linearly till final tensile fracture with the lowest tensile strength and failure strain, due to the low interface shear strength (i.e., τiss = 50.8 ± 15.3 MPa). For C/(PyC)300 nm/SiC, the minicomposite with the moderate ISS (i.e., τiss = 62.2 ± 5.9 MPa) possessed the highest tensile strength and failure strain with the highest interface debonding ratio (i.e., ηmax = 0.95). For C/(PyC+SiC)/SiC, the tensile strength and strain were both lower than those of C/(PyC)/SiC due to the lower η.
GRAPHICAL ABSTRACT
Acknowledgements
This research work was supported by the Pre-Research Fund under Contact of China No. 6142907200301 and National Natural Science Foundation of China (52072410). The authors also thank the National Key Laboratory of Science and Technology on High-strength Structural Materials in Central South University for their support. The authors also wish to thank the anonymous reviewers and editor for their helpful comments on an earlier version of the paper.
Disclosure statement
The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.
Data availability statement
The data used to support the present findings are included in the manuscript.