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Summary
Over the past five years, the electronic assembly industry has been examining a variety of alloy systems as lead‐free alternatives to the conventional 63Sn/37Pb eutectic system. Many of the proposed systems are quite interesting from a technical standpoint but fall short when considering practical issues such as cost, availability and repeatability of manufacture.
The purpose of this paper is to provide the industry with a practical and technically feasible, lead‐free process which can be implemented or used as a baseline to compare other more complex systems.
