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Welding International Volume 25, 2011 - Issue 7
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Articles

Ecologically clean solder based on Sn–Ag–Cu

B. N. Perevezentsev Tol'yatti State University, Tol'yatti, Russia
&
M. N. Krumaev Tol'yatti State University, Tol'yatti, Russia
Pages 531-533 | Published online: 31 May 2011
 
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Abstract

A solder is developed, which does not contain harmful components such as lead and shows super performance properties, at the same time the processing behaviour of the solder remains unchanged.

Notes

1. Patent 2302932 (Russian Federation).

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