Producing orifices in structural materials by plasma, waterjet and laser cutting and piercing

Abstract

The article describes the results of comparison of special features of plasma, waterjet and laser cutting and piercing of structural materials used in radioelectronics. Each method has its own operating principle but they also have a common area of application and, therefore, there is competition amongst these methods. The main advantages and shortcomings of the methods are discussed.

Keywords::

• electronics
• structural materials
• processing methods
• plasma cutting
• water jet cutting
• laser cutting