Nanotechnology of metal and non-metal joining

Abstract

The development of electronics and high-voltage discharge process simulations facilitated the development of a new method of joining metals and non-metals in Russia. A prospective method has been proposed for joining materials with specific physical and mechanical properties under conditions of decreased temperature and pressure – welding with metallic inserts (foil). During controlled high-voltage discharge, the insert material quickly evaporates. Thus, the obtained metal vapours with high kinetic energy hit the surface of the materials being joined, where the crystallization process occurs. A thin layer of metal is created on the surface of the non-metal, tightly adhering to the substrate and with the same crystal lattice as the non-metal material. Joints of high durability are achieved due to this metallic interlayer. The marginal heating of the non-metal substrate is an important aspect of the process. The article presents some of the crystallographic aspects of metal and non-metal joining by means of surface metallization with metallic vapours obtained as a result of evaporation of the foil material following an electric discharge.