![Sample our Physical Sciences journals, sign in here to start your FREE access for 14 days]({"type":"image" , "src" : "/sda/110819/TOC-Subject-Sample-2021-Physical-Sciences.jpg"})
Abstract
An actual problem when using powder solders is their dosage. The quality of the solder joint largely depends on the accuracy of the dosage, the location on the node, the uniformity of the application, and other factors. To solve these problems, various technological methods of applying solders, as well as semi-finished products from powders, including powder tapes on an organic binder, are used. In this paper, the main requirements for powder tapes are formulated. The influence of the physical properties of powder materials, such as particle size and shape, bulk, and pycnometric densities, on the uniformity of the particle distribution in the tape, as well as the density of the solder tape, is considered. To assess the effect of the shape and size of the particles on the properties of the tape, three powder solders were used in the study: spherical copper phosphorus solder P14, composite nickel solder VPr11-40N in the form of a mechanical mixture of spherical and rounded particles, and plate copper-nickel solder MNMc 9-23.5. The technology for producing powder tapes with the calculation of the optimal amount of binder depending on the shape of the particles is developed and described, methods for determining such parameters of the tapes as the uniformity of distribution and the density of the powder solder in the volume are developed. Recommendations on the choice of the shape and size of the particles for obtaining the most dense and uniform solder tape are formulated.