Critical variables in IC Packaging Wire Bonding Process (ICPWBP): Ulrasonic (US) power, force and temperature

Abstract

Accompanied with the improvement of manufacturing technology of Integrated Circuits (IC), packaging technology must also be improved to raise yields of the related processes. In this paper, the yields of the critical variables in IC packaging manufacturing system are improved. We presented a TQFP (Thin-Quad-Flat Pack), the wire bonding processes were analyzed and determined to be the critical processes, and the concept of signal-to-noise ratio in Taguchi Method was applied to determine the ultimate parameters for the wire bonding processes. Also, the process capability analysis was conducted. We presented the critical variables in IC Packaging Wire Bonding Process (ICPWBP): ball shear/wire pull of ultrasonic (US) power, ball shear/wire pull offeree, and temperature.

Keywords:

• IC packaging
• wire bonding
• critical variables
• process capability (C_pk)