積體電路多樣產品生產線製造績效評估之硏究

摘要

以代工爲導向的積體電路廠商，為因應目前抖技不斷地進步和顧客的要求日益增多，其生產線生產的產品必須多樣化，此時若要衡量生産線的製造績效將會相當困難。—般積體電路廠商在衡量各生產線的製造能力時，均以良率或缺陷密度爲指標，其中良率因可直接反映成本，故是最常用的指標。當某生產線的良率髙於其他生產線的良率，即表示此生產線的製造能力較強。但是這種比較僅限於生產同產品的不同生產線間製造績效的評比，常評估生產多樣性產品生產線的製造績效時，因爲各生產環境的製造參數（如：產品的持性、製程的狀況）在各生產線均不同，若單純地以良率來表達製造績效就會產生偏誤。譬如，同樣的缺陷數目、大小及分佈，對有複雜製程的產品所造成的良率損失就比對簡單製程所造成的損失要來得高。因此本研究提出一套利用修正卜瓦松良率模式來評估生產多種積體電路產品生產線製造績效的程序。其中包括製造績效指標之推導以及修正卜瓦松模式中參數估計方法之發展。最後本研究以一個新竹科學園區積體電路廠商生產線上之實際資料來說明及驗證本程序的可行性。

Abstract

Evaluating the manufacturing performance among different proouction lines in IC fabrication is a relevant task. The yield is a conventional index to indicate which production line has a better manufacturing performance. However, although the yield index can be used to compare several lines producing the same IC product, it can not be utilized to compare the performances of lines under circumstances such as one line producing different products at different time intervals and different lines producing different products. The fact that the production parameters (e.g. chip area, mask. levels, and minimum dimension) vary when fabricating various types of chips accounts for why defects with the same number, size, or distribution may lead to different degrees of yield loss. Therefore, in this study, we present a novel procedure to evaluate the manufacturing performance of multiple production lines. A manufacturing performance index (Mill) is also derived on the basis of a cluster-modified Poisson yield model to measure the degrces of maturity of the products. In addition, two methods, i.e. generic method, regression method, for estimating the parameters in the yield model are also proposed. Moreover, a case study demonstrates the effectiveness of the proposed manufacturing performance index in terms of its ability to evaluate the multiple production lines in IC fabrication.

關鍵字:

• 製造績效
• 積體電路
• 良率模式
• 製程缺陷
• 多樣產品生產線

Key Words:

• manufacturing performance
• integrated circuit
• yield model
• process defect
• multiple production lines