Deep Eutectic Ionic Liquids as Epoxy Resin Curing Agents

Abstract

Epoxy compositions based on low-molecular bisphenol A type resin and deep eutectic solvents from choline chloride (ChCl) and guanidine derivatives or urea were prepared and investigated. Pot life at room temperature and curing process at dynamic mode were studied using DSC and rheometry while DES basic ratio was changed in a range of 3–9 wt. part/100 wt. part of epoxy resin (phr). Thermomechanical properties (glass transition and tan δ) of the cured epoxy materials (DES content up to 20 phr) using DMTA and their thermal resistance on the basis of thermogravimetric measurements were evaluated. The curing mechanism, i.e., ratio of polyaddition reaction to catalytic polymerization, was evaluated considering changeable guanidine derivative content in relation to epoxy resin.

Keywords:

• Deep eutectic solvent
• Epoxy resin curing
• Guanidine derivatives
• Thermomechanical properties

Notes

*From DSC measurement.

**Melting point depression as related to lower melting DES component.