A novel three-dimensional dual-band balun with frequency-independent phase difference and complete ground

Lidan YaoSchool of Electronic Engineering, Beijing University of Posts and Telecommunications, P.O. Box 282, 100876, Beijing, People's Republic of ChinaView further author information

Yongle WuSchool of Electronic Engineering, Beijing University of Posts and Telecommunications, P.O. Box 282, 100876, Beijing, People's Republic of ChinaCorrespondence[email protected]
[email protected]
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Lingxiao JiaoSchool of Electronic Engineering, Beijing University of Posts and Telecommunications, P.O. Box 282, 100876, Beijing, People's Republic of ChinaView further author information

Yuanan LiuSchool of Electronic Engineering, Beijing University of Posts and Telecommunications, P.O. Box 282, 100876, Beijing, People's Republic of ChinaView further author information

Abstract

A novel three-dimensional (3D) dual-band balun employing the double-sided parallel-strip line (DSPSL) with inherent impedance-transforming capability and complete ground is presented in this paper. The proposed balun is mainly composed of two mutually perpendicular printed circuit boards (PCBs), one of which is a horizontal feeding plane with a slender slot and the other of which is a mounted board vertical to the former.

An unbalanced input port and two balanced output ports are totally located at the feeding plane. Utilising the configuration of DSPSL, two different dual-band impedance transformers of two sections are placed in the top and bottom layers of the vertical mounted board respectively. Thus, the transformers are applicable to transform impedances at two frequencies simultaneously. Furthermore, the 180° phase difference is frequency-independent, which facilitates the broadband operation. For verification, two numerical examples with different frequency ratios are designed and simulated, one of which is fabricated on a Rogers 4350B board. Both the simulated and measured results exhibit excellent performance and agree well with each other. In essence, this 3D balun is comprised of a single-layer planar circuit configuration. Consequently, owing to easy integration and low cost, it will be widely applied in the balanced radio frequency components.

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Notes on contributors

Lidan Yao

Notes on contributors

Miss Lidan Yao received her B.Sc. degree in Communication Engineering from the Yanshan University, Qinhuangdao, People's Republic of China, in 2014. She is currently working to obtain the M.Sc. degree in Electronic Engineering at the Beijing University of Posts and Telecommunications (BUPT), People's Republic of China. Her research interests include wideband differential microwave components and dual-band passive components design.

Yongle Wu

Prof Yongle Wu received his BEng degree in Communication Engineering and Ph.D. degree in Electronic Engineering from the BUPT in 2006 and 2011, respectively. From April to October 2010, he was a Research Assistant at the City University of Hong Kong. In 2011, he joined the BUPT and is currently an Associate Professor in the School of Electronic Engineering. His research interests include microwave components and wireless systems design.

Lingxiao Jiao

Mr Lingxiao Jiao received his B.Sc. degree in Electronic Science and Technology from the BUPT in 2014. He is currently working to obtain the Ph.D. degree at the same university. His research interests include microwave passive components, antennas and RF systems.

Yuanan Liu

Prof Yuanan Liu received his BEng, MEng and Ph.D. degrees in Electrical Engineering from the University of Electronic Science and Technology of China, Chengdu, People's Republic of China in 1984, 1989 and 1992, respectively. In 1984, he joined the 26th Institute of Electronic Ministry of the People's Republic of China to develop the inertia navigating system. In 1992, he began his first post-doctoral position in the Electromagnetic Compatibility (EMC) Laboratory at the BUPT. In 1995, he started his second post-doctoral position in the broadband mobile laboratory of the Department of System and Computer Engineering, Carleton University, Ottawa, Canada. From July 1997, he has been a Professor with the Wireless Communication Centre of the College of Telecommunication Engineering, the BUPT, where he is involved in the development of next-generation cellular systems, wireless LAN, Bluetooth applications for data transmission, EMC design strategies for high-speed digital systems and electromagnetic interference (EMI) and electromagnetic susceptibility (EMS) measuring sites with low cost and high performance. He is interested in smart antennas for high-capacity mobile signal processing techniques in fading environments, EMC for high-speed digital systems, Inter Symbol Interference (ISI) suppression, orthogonal frequency division multiplexing (OFDM) and multicarrier system design.

He is also a Senior Member of the Electronic Institute of China.

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