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Abstract
This paper describes a systematic attempt to isolate various parameters that affect the material removal rate for diamond grinding of silicon nitride ceramics. The influence of different coolants and operating parameters such as force, depth of cut, and diamond grit size on the material removal rates under controlled conditions of single pass grinding is determined. Several parameters were developed to aid in interpretation of the grinding results. The parameters include grinding force coefficient, retained grinding efficiency, and instantaneous grinding rate. A grinding map concept was developed to allow rapid visual evaluation of grinding performance for a given coolant and a set of operating conditions.
The results suggest that material removal rates in grinding of silicon nitride ceramics can be increased through optimization of machining parameters and the proper use of suitable coolants. The major contribution to decreased grinding rates for silicon nitride machining in these tests was due to dulling of the diamond abrasive embedded in the grinding wheel. Significant coolant chemistry effects were observed as it affects the diamond dulling rate due to oxidative wear mechanisms.
