NUMERICAL SIMULATION OF SOLUTE REDISTRIBUTION DURING TRANSIENT LIQUID PHASE BONDING PROCESS FOR AL-CU ALLOY

Abstract

A one-dimensional mathematical model is developed to predict the solute redistribution during the transient liquid phase (TLP) bonding process for Al-Cu alloy. The macroscopic solute diffusion in the liquid and the solid as well as for the solid transformation to the liquid because of the solute macrosegregation are considered in this study. The effects of holding temperatures and the interlayer thickness on the holding time, remelting layer thickness, and the mush zone thickness of the TLP bonding process are investigated. It is shown numerically that the holding time, the holding temperature, and the interlayer thickness influence the solute distribution strongly, which in turn influence the mush zone thickness significantly.