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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 47, 2005 - Issue 7
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Original Articles

RAPID TRANSIENT HEAT CONDUCTION IN MULTILAYER MATERIALS WITH PULSED HEATING BOUNDARY

, , &
Pages 633-652 | Received 20 May 2004, Accepted 01 Oct 2004, Published online: 01 Sep 2006
 

ABSTRACT

Rapid transient heat conduction in multilayer materials under pulsed heating is solved numerically based on a hyperbolic heat conduction equation and taking into consideration the non-Fourier heat conduction effects. An implicit difference scheme is presented and a stability analysis conducted, which shows that the implicit scheme for the hyperbolic equation is stable. The code is validated by comparing the numerical results with an existing exact solution, and the physically unrealistic conditions placed on the time and space increments are identified. Using the validated model, the numerical solution of thermal wave propagation in multilayer materials is presented. By analyzing the results, the necessary conditions for observing non-Fourier phenomena in the laboratory can be inferred. The results are also compared with the numerical results from the parabolic heat conduction equation. The difference between them is clearly apparent, and this comparison provides new insight for the management of thermal issues in high-energy equipment. The results also illustrate the time scale required for metal films to establish equilibrium in energy transport, which makes it possible to determine a priori the time response and the measurement accuracy of metal film, thermal-resistant thermometers.

This work was partially supported by Grant #HKUST6014/02E from the Research Grant Council of Hong Kong and partially by the U.S. Office of Naval Research, Grant ONR N000140010454 and the National Science Foundation CTS-0312848.

Notes

a Estimated from Eq. (Equation2) and [Citation5 Citation9].

b Adopted from [Citation28].

a Estimated from = Eq. (Equation2) and [Citation5 Citation9].

b Adopted from [Citation28].

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