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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 54, 2008 - Issue 4
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Original Articles

Bubble Dynamics, Flow, and Heat Transfer during Flow Boiling in Parallel Microchannels

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Pages 390-405 | Received 11 Jun 2008, Accepted 05 Mar 2008, Published online: 16 Jun 2008
 

Abstract

Significant efforts have recently been made to investigate flow boiling in microchannels, which is considered an effective cooling method for high-power microelectronic devices. However, a fundamental understanding of the bubble motion and flow reversal observed during flow boiling in parallel microchannels is lacking in the literature. In this study, complete numerical simulations are performed to further clarify the boiling process by using the level-set method for tracking the liquid–vapor interface which is modified to treat an immersed solid surface. The effects of contact angle, wall superheat, and the number of channels on the bubble growth, reverse flow, and heat transfer are analyzed.

This work was supported by a Special Research Grant of Sogang University.

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