Estimation of the Transient Heat Transfer Rate at the Boundary of an Electronic Chip Packaging

Abstract

In this study, an inverse algorithm based on the conjugate gradient method and the discrepancy principle is applied to estimate the unknown time-dependent heat transfer rate at the electronic-packaging/heat-sink-assembly interface from the knowledge of temperature measurements taken within the packaging. The temperature data obtained from the direct problem are used to simulate the temperature measurements, and the effect of the errors in these measurements upon the precision of the estimated results is also considered. Results show that an excellent estimation on the time-dependent heat transfer rate can be obtained for the test case considered here.

This work was supported by the National Science Council, Taiwan, Republic of China, under the grant numbers NSC 95-2221-E-168-025 and NSC 95-2221-E-168-033.