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Abstract
This work deals with the melting and natural convection in a rectangular enclosure heated from three discrete protruding electronic components (heat sources) mounted on a conducting vertical plate (substrate). The heat sources generate heat at a constant and uniform volumetric rate. A part of the power generated in the heat sources is dissipated to the phase change material (PCM, n-eicosane with a melting temperature T m = 36°C) that filled the enclosure. To investigate the thermal behavior of the proposed heat sink, a mathematical model, based on the mass, momentum, and energy conservation equations was developed. The model has been verified and then validated comparing the melting front with available experimental results. Numerical investigations have been conducted in order to examine the effects of the electronic components thickness and the plate thermal diffusivity on the maximum temperature of electronic components. The percentage contribution of plate heat conduction on the total removed heat and temperature profile in the plate have also been analyzed. Correlations for the nondimensional secured working time (time to reach the threshold temperature, T cr = 75°C) and its corresponding melt fraction were derived.
Notes
Δt = 20 s.
M × N = 60 × 80.