A study on the effect of the number of fin valleys on the thermal performance of a bus duct conductor

Abstract

This paper presents a finite volume-based simulation study on the effect of the fin valley's number on the thermal performance of a bus duct conductor. A numerical model that closely mimics the experimental setup was developed using ANSYS FLUENT. The experimental data were used as a benchmark and followed the IEC 61439-1/2 standards. Five fin valley numbers were considered: s₁=2, s₂=3, s₃=4, s₄=5 and s₅=6. It was determined that the average surface temperature decreased as the number of fin valleys increased. From the analysis, it was observed that as the number of fin valleys increased, convection heat transfer improved as a consequence of enhanced surface Nusselt number. The best number of fin valleys was s₅=6, exhibiting superior thermal performance over a lower number of fin valleys. This study is expected to provide a better understanding of the fin valley’s effects on the thermal performance of a bus duct conductor’s casing.

Keywords:

• Bus duct conductor
• computational fluid dynamics
• fin valley
• heat sink
• heat transfer

Acknowledgments

Acknowledgement to “Collaborative Research in Engineering, Science and Technology (CREST)” grant with Project Code 304/PBAHAN/6050448/C121. The authors would also like to thank Universiti Sains Malaysia and Furutec Electrical Sdn. Bhd for providing technical support.

Disclosure statement

The authors report there are no competing interests to declare

Additional information

Notes on contributors

Mark Selvan

Mark Selvan holds a Bachelor of Science Degree in Mechanical Engineering and is currently pursuing a Master of Science degree in Mechanical Engineering from the Universiti of Sains Malaysia. He also has industrial experience while working as an equipment engineer at TF-AMD Microelectronics. His research interest is in finite element analysis with focus on the development of numerical models for heat transfer design optimization.

Mohd Sharizal Abdul Aziz

Mohd Sharizal Abdul Aziz received the Bachelor in Mechanical engineering and the M.Sc. and PhD degrees in Computational Fluid Dynamics (CFD) specializing in thermofluids and electronic packaging from Universiti Sains Malaysia. Currently, he is a lecturer at School of Mechanical Engineering, Universiti Sains Malaysia. He has a vast knowledge and experience (almost 13 years) in CFD, particularly in Fluid-Structure Interaction (FSI). His current research interest includes CFD, FSI, electronic packaging, and heat and mass transfer.

Kok Hwa Yu

Yu Kok Hwa received his Bachelor of Engineering (Honours) in Aerospace Engineering from Universiti Sains Malaysia (USM) in 2008, Master of Science degree from the same university in 2011, and obtained his Ph.D. in the field of fluid mechanics from National University of Singapore (NUS) in 2016. He is a graduate member of the Board of Engineers Malaysia (BEM) and currently he is a lecturer in the School of Mechanical Engineering, University Sains Malaysia. His current research interests are focused on thermal management in microfluidics application, micro mixing applications, flow stability and surface mount technology. He was a recipient of the Fellowship RLKA Universiti Sains Malaysia, USM Fellowship and USM Graduate (Teaching) Assistant. He was previously attached as a visiting scholar to a project on miniature UAV development in National University of Singapore (NUS) in 2011. He is also involved in a project in investigating the potential of suspended liquid-gas interfaces for heat transfer applications in channels under turbulent flow condition as a research engineer in the Department of Mechanical Engineering, NUS

M. S. Nurulakmal

Nurulakmal Mohd Sharif received her Bachelor’s degree in Material Engineering from Universiti Sains Malaysia and her PHD in metallurgy from the University of Wales. Currently, she is a lecturer at the School of Materials & Mineral Resources Engineering, Universiti Sains Malaysia. Her expertise is in Lead-free solder, metal matrix composite, metallurgy, metals and alloys and recycling

H. P. Ong

Ong Heng Pin holds a Bachelor of Science Degree in Biology and Chemistry. Have more than 17 years industrial experience in manufacturing field. Currently, holding Senior Manager position that in charge of R&D section and Quality Assurance section in Furutec Electrical Sdn. Bhd.

Chu Yee Khor

C. Y. Khor received the bachelor degree in mechanical engineering, and the M.Sc and Ph.D. degrees in Mechanical Engineering, specializing in electronic packaging from Universiti Sains Malaysia, Minden, Malaysia, in 2008, 2010 and 2013, respectively. He was a Post-Doctoral Fellow at School of Mechanical Engineering, Universiti Sains Malaysia, 2014. Currently, he is a senior lecturer at the Faculty of Mechanical Engineering & Technology, Universiti Malaysia Perlis (UniMAP), Perlis, Malaysia. Dr Khor is a journal reviewer of Microelectronics Reliability, Heat and Mass Transfer, International Journal of Heat and Mass Transfer, Arabian Journal for Science and Engineering, Soldering & Surface Mount Technology, Journal of Electronic Packaging, Microelectronics International, etc.

Wan Rahiman

Wan Rahiman received her Bachelor’s degree in Mechanical Engineering Cardiff University and his PHD from the University of Manchester. Currently, he is a researcher at the Cluster of Smart Port and Logistic Technology (COSPALT), Engineering Campus, Universiti Sains Malaysia. His expertise is in thermal cooling, System stability, Control system, and Autonomous Vehicle.