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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 85, 2024 - Issue 14
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Articles

Heat transfer augmentation by plate motion in a wall jet flow over a heated plate: A conjugate heat transfer technique

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Pages 2280-2297 | Received 08 Feb 2023, Accepted 19 May 2023, Published online: 16 Jun 2023
 

Abstract

The present study is an initiation to investigate the effect of plate movement on heat transfer characteristics in the solid plate and the fluid domain due to the turbulent wall jet flow over the plate in a quiescent surrounding. A conjugate technique is used to carry out the heat transfer solution that involves conduction in solid and convection in fluid coupled at the interface surface. The plate is heated continuously with a constant flux at its lower surface. A low-Reynolds number kε turbulence model developed by Yang and Shih (YS) is applied to simulate the turbulent flow. The parameters considered for the present study are the plate-jet velocity ratio (02), the plate thickness ratio (0.51.5), the conduction ratio (5002000), and the Reynolds number (770025,000). The temperature distribution diagrams for various plate velocities, the interface temperature profile, and the averaged Nusselt number show a higher cooling rate at high plate-jet velocity ratios. The effect of plate thickness and conductivity ratios is visible in the temperature distribution diagrams. A better heat transfer is achieved at a higher Reynolds number, evident from the averaged and local Nusselt number distribution. A correlation is developed for average Nusselt number with the Reynolds number and plate-jet velocity ratios as the varying parameters.

Disclosure statement

There are no conflicts relevant to the article among the authors.

Ethical approval

This article does not include any human participants or animals.

Additional information

Funding

The authors appreciate the financial grant provided by Science and Engineering Research Board (SERB), Department of Science and Technology, Govt. of India (File No. ECR/2017/000437).

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