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Abstract
This paper reports the implementation of a new method for temperature calculations in plane multilayered systems. The method involves both analytical and numerical approaches to heal flow analysis and is well suited for power semiconductor systems where plane power dissipation can be assumed. The general case of an N-layered system is presented and some examples of calculations are given. The method, which involves short computation times, is usable on small computer systems and offers an alternative to finite-difference or finite-element methods as long as plane multilayered systems are considered.