THREE-DIMENSIONAL COUPLED CONDUCTION-CONVECTION PROBLEM FOR THREE CHIPS MOUNTED ON A SUBSTRATE IN AN ENCLOSURE

Abstract

The coupled heat conduction / convection problem for three heated chips mounted on a conductive substrate in a three–dimensional enclosure filled with air is solved by an operator–splitting pseudo–time–stepping finite element method, which automatically satisfies the continuity of the interfacial temperature and heat flux, The main feature of the solution procedure is that the multiphases are treated as a single computational domain with unknown interfacial boundary conditions. The temperature distribution in the chips, in the substrate, and in the surrounding air, together with the connective flow pattern are obtained simultaneously. A maximum dimensionless temperature correlation is developed and can successfully predict the maximum temperature in heat sources, which provides a useful tool for the electronic designer.

Notes

Address correspondence to Professor Nhan Phan-Thien, Department of Mechanical and Mechatronic Engineering, Sydney, The University of Sydney, NSW 2006, Australia. E-mail: [email protected]

Additional information

Notes on contributors

Yang Liu

This research was funded by a Sydney University/CSIRO collaboration through scholarship support to Y. Liu. This support is gratefully acknowledged. The FastflotTM code is provided by the Division of Mathematics and Statistics, CSIRO. The computation work was done at the computation facility of the Sydney Distributed Computing Laboratory.

Ronald Kemp

Present address of Ronald Kemp is CSIRO Division of Applied Physics, Lindfield, NSW 2070, Australia.

Xiao-Lin Luo

Present address of Xiao-Lin Luo is CSIRO Division of Mathematics and Statistics, North Ryde,NSW 2113, Australia.