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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 32, 1997 - Issue 7
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Original Articles

STUDY OF COMBINED HEAT TRANSFER IN A THREE-DIMENSIONAL ENCLOSURE WITH A PROTRUDING HEAT SOURCE

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Pages 733-747 | Received 07 Mar 1997, Accepted 27 Jun 1997, Published online: 12 Mar 2007
 

Abstract

An experimental and numerical study of three-dimensional natural convection-radiation conjugate heat transfer in an enclosure adjacent to a heat-generating chip has been performed. A three-dimensional simulation model is developed by considering heat transfer phenomena by conduction, convection, and radiation. Radiative transfer is analyzed with the discrete ordinates method. Experiments were conducted to validate the numerical model. Comparisons with experimental data show that good agreement is obtained when the radiation effect is considered. The effects of thermal conductivity of the substrate and power level of the chip on heat transfer are investigated. It is shown that radiation is the dominant heat transfer mode and that the thermal conductivity of the substrate has important effects on heat transfer in the enclosure.

Notes

Address correspondence to Dr. Kwan-Soo Lee, School of Mechanical Engineering, Hanyang University, 17 Haengdang-dong, Sungdong-Ku, Seoul, 133-791, Korea. E-mail: [email protected]

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