SiO_2f/SiO₂ composite grinding characteristics based on maximum undistorted chip thickness

ABSTRACT

The thickness of the maximum undistorted chip (a_gmax) is a crucial component of the machining arguments and significantly affects the quality of the grind. For the purpose of investigating the impact of the a_gmax on the grinding removal properties of SiO_2f/SiO₂ composites, grinding experiments of SiO_2f/SiO₂ composites were conducted. The findings indicate that crack propagation, fiber cracking, matrix breaking, and interface debonding are the primary removal modes of SiO_2f/SiO₂ composites. Grinding force, surface roughness, and chip size all have a positive correlation with the maximum undeformed chip thickness. Surface brittle fracture brought on by SiO₂ fiber microcrack results in little surface roughness. The surface quality degrades when bending fracture and compression fracture take place. Controlling the a_gmax can enhance the grinding surface quality of SiO_2f/SiO₂ composites.

KEYWORDS:

• SiO_2f/SiO₂
• composites
• grinding
• chip
• fiber
• removal
• mechanism

Disclosure statement

No potential conflict of interest was reported by the author(s).

Supplementary material

Supplemental data for this article can be accessed online at https://doi.org/10.1080/10426914.2023.2254366.

Additional information

Funding

This work is supported by the National Key Research and Development Program of China (2019YFA0708902), the Supported by High Level Talents Innovation Plan of Dalian, (2020RD02), the Fundamental Research Funds for the Central Universities (DUT22LAB501), and the National Natural Science Foundation of China (52275411).