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Abstract
The present work illustrates the use of water-soluble cupric(II) salts as ingredients of binder for injection molding of W-10 wt.% Cu. The parts produced are dense, homogeneous and have good surface finish, compared to those produced using conventional binder systems. This new binder system, named Cu-containing binder (CCB), also provides process-simplification benefits. CuCl2 and Cu(NO3) 2 with the purity of 98% were selected for this study. A rapid two-stage process involving drying and thermal decomposition was successful in removing nonmetatlic constituents from 2 to 3 hours. Final density that is above 97% of theoretical value was obtained.