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Integrated Ferroelectrics
An International Journal
Volume 75, 2005 - Issue 1
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SECTION E: FeRAM MATERIALS AND DEVICES

MOCVD GROWTH OF (Pb,Ba)(Zr,Ti)O3 THIN FILMS FOR MEMORY APPLICATIONS

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Pages 225-233 | Received 17 Apr 2005, Published online: 15 Aug 2006
 

ABSTRACT

We are reporting on the modification of Pb(Zr,Ti)O3 (PZT) thin films by substitution of Ba for Pb. The (Pb,Ba)(Ti,Zr)O3 (PBZT) films are grown on iridium coated silicon substrates by a liquid delivery MOCVD technique. Four separate solutions of Pb (DPM)2, Ba (DPM)2, Ti (Oi Pr)2 (DPM)2, and a new zirconium precursor Zr (IBPM)4 were used. A PZT(30/70) film of 150 nm thickness shows a Pr value of 35 μ C/cm2, and Ec of 90.4 kV/cm. Ba substitution leads to suppressed tendency for phase separation, more homogeneous surface morphology, smaller grain sizes and easier growth with respect to adjustment of stoichiometry. PBZT films show low dielectric losses of 0.03 and high permittivity values of up to 1000. A decrease of the coercive field could not be observed.

ACKNOWLEDGMENTS

The authors want to thank T. Watanabe for fruitful discussions. The cooperation of Dr. Tasaki from Toshima MFG CO., LTD is gratefully acknowledged. We thank M. Gebauer for assistance with the MOCVD system, W. Krumpen for XRF analysis, G. Wasse for SEM characterization, D. Erdoglia for Pt deposition, and D. Braeuhaus for Ir-substrates.

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