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Integrated Ferroelectrics
An International Journal
Volume 88, 2007 - Issue 1
78
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SECTION I: MEMS, PYROELECTRIC/IR, OPTOELECTRONIC MATERIALS: THIN-FILM PROCESSING

EFFECT OF SILICON CARBIDE PASSIVATION FILM ON THE RESONANCE CHARACTERISTICS OF CANTILEVER

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Pages 76-84 | Received 31 May 2006, Published online: 12 Oct 2011
 

ABSTRACT

We have used silicon carbide (SiC) thin films as an insulating material of the PZT micro cantilevers for electrical and biological passivation. The use of SiC thin films as a passivation layer of the PZT microcantilevers is also seemingly viable to insure the high mass sensitivity as well as the stable passivation. In this study, we report the effect of SiC passivation layer on the performance of the PZT microcantilevers. The micromachined PZT microcantilevers having a structure of SiNx/Ta/Pt/PZT/Pt were fabricated through MEMS processes. In order to improve the mass sensitivity and the passivation, SiC thin films of the high elasticity material were deposited on the cantilever using plasma enhanced chemical vapor deposition (PECVD) at the temperature of 400°C. Plane-strain modulus of SiC thin film was measured by nanoindentation. We observed that SiC thin films showed higher Young's modulus than Si and SiO2. Before and after the deposition of SiC thin films, the end-tip deflection and the resonant frequency change of microcantilevers were measured by a confocal microscope and an impedance analyzer. It was confirmed that end-tip deflection of microcantilever was reduced by 13∼18% through the deposition of SiC thin films, indicating the stress relaxation of the microcantilevers.

ACKNOWLEDGMENTS

This research has been supported by the Intelligent Microsystem Center (IMC; http://www.microsystem.re.kr), which carries out one of the 21st century's Frontier R&D Projects sponsored by the Korea Ministry Of Commerce, Industry and Energy.

Notes

a Epitaxial layer of crystalline SiC on Si.

b Depending on substrate and thermal budget allowed.

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