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Integrated Ferroelectrics
An International Journal
Volume 26, 1999 - Issue 1-4
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Section H: Materials processing – CVD

New low temperature preparation of ferroelectric Bi4Ti3O12 thin films by MOCVD method

Pages 93-101 | Received 07 Mar 1999, Published online: 19 Aug 2006
 

Abstract

Pt/Bi4Ti3O12(001)/Bi2SiO5(100)/Si(100) structures have been fabricated by the metal-organic chemical vapor deposition (MOCVD) at 500°C. Bi2SiO5 film is used as a buffer layer to grow ferroelectric Bi4Ti3O12 films because of its relatively high dielectric constant (∊r=30). The memory window has a C-V characteristic of about 0.8 V, and the retention time estimated by the zero-bias capacitance for the Pt/100-nm-Bi4Ti3O12/30-nm-Bi2SiO5/Si/Al structure is more than 11 days.

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