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Abstract
A mathematical model predicting evaporation and fluid flow in evaporating film region formed on a curved surface is developed to determine the interface temperature, heat flux distribution, and film profile in the thin film region. The numerical results show that the temperature of an equilibrium film on the curved surface of solid wire is larger than that on a flat surface and the equilibrium film thickness formed on the curved surface of solid wire is smaller than the one on the flat surface if the bulk fluid curvature of both evaporating film regions is the same. The rate of increase of the magnitude of total heat transport through the evaporating thin film region per unit length begins to decrease with larger superheat temperature due to the effect of a decreasing evaporating film region length. This potentially produces a limit of the maximum amount of heat transport through the micro regions for a given evaporator geometry. The current investigation provides a better understanding of the effects of interfacial forces on evaporation and fluid flow in thin film regions formed on a curved surface.