Thermal stability of self-supported nanolayered Cu/Nb films

Abstract

We report the development of thermally stable nanoscale layered structures in sputter deposited Cu/Nb multilayered films with 75 nm individual layer thickness, vacuum annealed at temperatures of 800°C or lower. The continuity of the layered structure was maintained and layer thickness unchanged in the annealed films. The nanolayers were observed to be offset by shear at the triple-point junctions that had equilibrium groove angles and were aligned in a zigzag pattern. A mechanism is proposed for the evolution of this ‘anchored’ structure that may be resistant to further morphological instability.

Acknowledgements

This work is supported by the US Department of Energy, Office of Science, Office of Basic Energy Sciences. Authors acknowledge discussions with D. Josell, F. Spaepen, N. Sridhar, P.M. Anderson, J.D. Embury and J.P. Hirth.

Notes

‡ Present address: US Department of Energy, Division of Materials Sciences and Engineering, Washington, DC 20585, USA

Additional information

Notes on contributors

H. Kung ‡

‡ Present address: US Department of Energy, Division of Materials Sciences and Engineering, Washington, DC 20585, USA