Shape memory behaviour of annealed Ti_48.5Ni_(51.5−x)Cu_x (x = 6.2–33.5) thin films

Abstract

The shape memory behaviour of (Ni,Cu)-rich Ti–Ni–Cu thin films (Ti_48.9Ni_44.9Cu_6.2, Ti_48.5Ni₄₀Cu_11.5, Ti_48.6Ni_35.9Cu_15.5, Ti_48.3Ni_28.4Cu_23.3, Ti_48.3Ni_23.9Cu_27.8 and Ti_48.5Ni₁₈Cu_33.5) annealed at 773, 873 and 973 K for 1 h was investigated. The films with 6.2, 11.5–15.5 and 23.3–33.5 at% Cu showed a single-stage deformation due to a B2 ↔ B19′ transformation, a two-stage deformation due to the B2 ↔ B19 ↔ B19′ transformation and a single-stage deformation due to the B2 ↔ B19′ transformation, respectively. The martensitic transformation start temperature (M _s) increased with increasing Cu content and then levelled off for more than 15 at% Cu, indicating a high Ms temperature of 345 K. Temperature hystereses were almost 15 K for all films with more than 10 at% Cu. The critical stress for slip increased with increasing Cu content and increased significantly for the Ti_48.5Ni₁₈Cu_33.5 film, whereas the maximum recoverable strain significantly decreased for the Ti_48.5Ni₁₈Cu_33.5 film. With decreasing annealing temperature, the critical stress for slip increased, but the M _s temperature decreased. It was found that films with 11.5 at% Cu or more, annealed at 873 K, showed a high martensitic transformation temperature and a high critical stress for slip.

Keywords:

• martensitic transformation
• mechanical behaviour
• shape memory alloys
• shape memory effect
• sputtering
• thin films
• Ti-Ni-Cu