Analytical model of transient compressive stress evolution during growth of high diffusivity thin films on substrates

Abstract

We present an analytical model of transient compressive stress evolution during growth of thin films with high surface and grain boundary diffusivities on substrates. The model provides a closed-form analytical solution which compares well with numerical analysis as well as recent experimental data on transient stress evolution during electrodeposition of Sn films on substrates.

Keywords:

• thin films
• analytical model
• thin film stresses
• grain boundary
• diffusion
• Volmer–Weber growth

Acknowledgement

The work reported has been supported by the National Science Foundation through grant CMMI-0758535 and through the MRSEC on Nano and Micromechanics of Materials, grant DMR-0520651.