Thermophysical properties of Cu–In–Sn liquid Pb-free alloys: viscosity and surface tension

Abstract

The viscosity of a few Cu–In–Sn liquid alloys has been investigated by a number of geometric (Muggianu, Kohler, Toop) and physical thermodynamic models (Kozlov–Romanov–Petrov, Budai–Benko–Kaptay, Schick et al.) and GSM for the cross section (z/y = 1/3) in Pb-free liquid alloy Cu_x–In_y–Sn_z at 1073 K. Moreover, the surface tensions of the same liquid alloys have been investigated by a number of geometric models and the Butler model for the cross section Cu_x–In_y–Sn_z (z/(y + z) = 0, 0.1, 0.3, 0.5, 0.7, 0.9, 1) at the same temperature. The best agreement of the surface tensions was obtained in the Kohler model for x_Cu = 10 at % and the Butler model for x_Cu = 20 at % and x_Cu = 30 at.%, respectively. The best agreement among chosen geometric and physical models and experiment for these selected sections Cu₈₀In₁₅Sn₅, Cu₇₅In₁₅Sn₁₀, Cu₅₅In₇Sn₃₈, Cu₃₃In₅₀Sn₁₇ and Cu₂₆In₅₅Sn₁₉ at 1073 K was obtained for the Budai–Benkö–Kaptay model.

Keywords:

• Viscosity
• surface tension
• geometric models
• physical models
• Butler equation
• Pb-free ternary solder alloys