Abstract
The change in the electrical resistivity of gold foils due to the introduction of (a) stacking faults, and (b) lattice vacancies, is correlated with concentration counts obtained by transmission electron microscopy. The resistivity of stacking faults is found to be ρSF = [1·8 ± 0·3] × 10−13 β Ω cm2 for a stacking-fault density equal to β cm−1. A lower limit for the resistivity of vacancies is ρv = [2·4 ± 0·4] × 10−6 Ω cm/atomic % vacancies.