Stress analysis in adhesive layers of a five-layer circular sandwich plate subjected to temperature gradient based on layerwise theory

Abstract

Layerwise theory (LT) along with third-order, hyperbolic, and combination of sinusoidal and exponential shear deformation theories (TSDT, HSDT, and SESD) is applied to calculate thermal stresses in a five-layer simply supported circular sandwich plate subjected to a temperature gradient. The sandwich plate is made of five layers consisting of two functional graded (FG) face sheets, two adhesive layers, and one core. The results are compared to finite element (FE) and indicate that the results of LT along with SESD are closer to those obtained by FE in comparison with TSDT and HSDT. Moreover, the effects of the geometrical and mechanical characteristics of face sheets as well as mechanical properties of adhesive are studied to determine the stress distribution in adhesive layers. The results show that the variation of the FG of face sheets has more effect on the adhesive shear and piling stresses than the planner stresses.

Keywords:

• Thermal stress
• layerwise theory
• TSDT
• HSDT
• SESD