Abstract
We report screen-printed copper source/drain electrodes for a-InGaZnO (a-IGZO) thin-film transistors (TFTs). The best electrical characteristics of the a-IGZO TFTs were a field-effect mobility of 2.06 cm2/Vs, a threshold voltage of 3.40 V, an on/off current ratio of 6.0 × 103A/A, and a subthreshold swing of 7.02 V/decade. Resulting TFT performances indicate that blocking the inter-diffusion of Cu and impurities is a key factor to fabricate low leakage current and high performance a-IGZO TFTs with printed Cu S/D electrodes.
Acknowledgment
This work was supported by the Industrial strategic technology development program (10041041, Development of non-vacuum and non-lithography based 5 width Cu interconnect technology for TFT backplane) funded by the Ministry of Knowledge Economy (MKE, Korea).