Abstract
The 3-omega method for thermal conductivity measurement using the hyperbolic heat conduction equation is presented. Mathematical expressions representing the conditions when non-Fourier effects cannot be neglected are formulated. Results obtained from Fourier and hyperbolic heat conduction equations based on parameterized dielectric thermophysical parameters are compared. The analysis is applied to a thin Chemical vapor deposited (CVD) diamond film and bologna meat and it is shown in these cases that by neglecting the non-Fourier effects one can underestimate the thermal conductivity by 50%.
Acknowledgement
This work is supported by the Lockheed Martin Corporation, within the LANCER project and the Welch Foundation under Grant No. BC-1494.