517
Views
4
CrossRef citations to date
0
Altmetric
Research Article

Thermoplastic and low dielectric constants polyimides based on BPADA-BAPP

, &
Pages 1482-1491 | Received 11 Dec 2019, Accepted 29 Mar 2020, Published online: 23 Apr 2020
 

ABSTRACT

The thermoplastic and low dielectric constants polyimides were introduced. The polyimides were prepared by pyromellitic dianhydride (PMDA) or 4,4ʹ-(4,4ʹ-Isopropylidenediphenoxy)diphthalic anhydride (BPADA) as anhydride monomer and 4,4ʹ-oxydianiline (ODA) or 2,2-bis(4-(4-aminephenoxy)phenyl)propane (BAPP) as amine monomer. The polyimides were well characterized by FT-IR, thermogravimetric analysis, dynamic thermomechanical analysis, dielectric measurement, and tensile test. The dielectric constants were 2.32–2.95 compared with 3.10 of ODA-PMDA polyimide, while partly polyimides were thermoplastic. The results indicated anhydride monomers, containing lateral methyl groups, made polyimides become thermoplastic. The results of molecular simulations via Materials Studio also proved this conclusion.

Graphical Abstract

Acknowledgments

Guorong Qiu thanked Professor Ma for his funds to support this research.

Additional information

Notes on contributors

Guorong Qiu

Guorong Qiu, the doctoral candidates works in South China university of technology.

Wenshi Ma

Wenshi Ma, the Professor  works in  South China university of technology.

Li Wu

Li Wu, the master was graduated from South China university of technology.

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.