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Abstract
Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, and lightweight, which has a wide range of application prospects in the field of electronic packaging thermal management. However, the serious interface problems between diamond and aluminum limit the full play of the thermal conductivity of composite materials. A reasonable interface design can maximize the thermal conductivity of composite materials. This article focuses on the interface modification of diamond/aluminum composites, briefly describing the theoretical basis of interface design, the research status of interface modification, interface reaction and composite stability, and prospects for diamond/aluminum composites material development.
Disclosure statement
No potential conflict of interest was reported by the authors.
Additional information
Funding
Notes on contributors
Zengkai Jiao
Zengkai Jiao, Writing - Review & Editing Preparation, Investigation, Formal analysis, Writing - Original Draft Preparation, Visualization.
Huiyuan Kang
Huiyuan Kang, Methodology, Investigation, Formal analysis, Visualization, Project administration.
Bo Zhou
Bo Zhou, Project administration, Resources, Funding acquisition.
Aolong Kang
Aolong Kang, Methodology, Formal analysis, Investigation.
Xi Wang
Xi Wang, Visualization.
Haichao Li
Haichao Li, Methodology.
Zhiming Yu
Zhiming Yu, Formal analysis.
Li Ma
Li Ma, Writing - Review & Editing Preparation, Project administration, Funding acquisition.
Kechao Zhou
Kechao Zhou, Writing - Review & Editing Preparation, Project administration, Funding acquisition.
Qiuping Wei
Quiping Wei, Writing - Review & Editing Preparation, Project administration, Funding acquisition.