The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part I: the effects of adhesive thickness

Abstract

Electronically conductive adhesives (ECAs) have received a great deal of attention for interconnection applications in recent years. Even though ECAs have excellent potential for being efficient and less costly alternative to solder joining in electronic components, they still possess a number of problems with respect to durability and design to meet specific needs. One of the issues that requires understanding is regarding the optimum adhesive thickness (AT) to be used. This study addresses this issue in relation to the formulations of the conductive adhesives and their interactions with adherend surfaces. For this purpose, two different adherends varying in surface characteristics were utilized along with three different conductive adhesive formulations with varying particle loadings, and shapes and sizes of conductive nickel fillers. Joints were also prepared with two different AT values, to gain insight into the influence of AT on the joint strength, deformation and joint conductivity. As the AT was increased, only a small reduction in failure load and ultimate displacement values were observed with unetched adherends. With etched adherends, however, a small increase in joint stretchability was evident with higher adhesive thickness tested at a lower crosshead speed. When the AT was increased, we also noted a corresponding increase in the initial joint resistance.

Keywords:

• ELECTRONICALLY CONDUCTIVE ADHESIVES
• ADHESIVE FORMULATIONS
• ADHESIVE THICKNESS
• SUBSTRATE SURFACE PROPERTIES
• BONDING PRESSURE
• JOINT PERFORMANCE
• NICKEL FILLERS
• CHEMICAL ETCHING
• SURFACE ROUGHNESS