A Millimeter-Wave E-Plane Band-pass Filter using Multilayer Low Temperature Co-Fired Ceramic (LTCC) Technology

Z. Wang School of Electronic Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 610054, China

X. Zeng School of Electronic Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 610054, China

B. Yan School of Electronic Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 610054, China

R. Xu School of Electronic Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 610054, China

W. Lin School of Electronic Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 610054, China

Abstract

This paper presents a substrate integrated waveguide (SIW)-based millimeter-wave E-plane band-pass filter (BPF) with multilayer Low Temperature Co-fired Ceramic (LTCC) technology. The vertical metal walls of SIW and metal fins of the evanescent waveguides are realized by closely spacing metallic via-holes. A three-order Chebyshev E-plane BPF is developed and verified by full-wave simulation. The proposed filter is fabricated using LTCC technology, and a tapered line is designed as the transition between the SIW and microstrip line. Good agreement between simulated and measured results is observed.

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A Millimeter-Wave E-Plane Band-pass Filter using Multilayer Low Temperature Co-Fired Ceramic (LTCC) Technology

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A Millimeter-Wave E-Plane Band-pass Filter using Multilayer Low Temperature Co-Fired Ceramic (LTCC) Technology

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