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Abstract
This paper presents a new concept of three-dimension (3D) transformer structure realized by through silicon via (TSV) technology. A set of 3D TSV transformers have been designed and analyzed. The results show that the proposed 3D TSV transformer possesses good performance with compact size. Finally, an AC to DC converter circuit based on proposed 3D TSV transformer has been designed. The result demonstrates that the proposed 3D TSV transformer is suitable for circuit design.