VLSI interconnections with a MMTL in a multilayered dielectric media

Abstract

In this paper, an analysis of VLSI interconnetions of a cylindrical multiconductor microstrip transmission line (MMTL) in a multilayered dielectric media based on finite and infinite element methods is presented. An approach is proposed for electromagnetic modeling of cylindrical MMTL (CMMTL) used in circuit simulations. This development is based on the assumption that the finite circuit transverse dimensions are comparable with the operating wavelength and quasi-TEM mode can be applied. A Maxwellian capacitance matrix per unit length (MCMPUL) is derived using energy functional formula of the Laplace's equation. The network equations are also derived applying the modified nodal admittance (MNA) method. The most useful parameters, e.g., modal characteristic impedance, normal mode propagation constant, effective dielectric constant, and networking function are obtained in terms of the MCMPUL. Numerical results are compared with those obtained by means of series expansion method. It is found to agree with other investigated results.