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Abstract
This work presents an extensive computational fluid dynamic (CFD) study of eductor agitation in an electroplating tank. The mathematical model of the hydrodynamic properties is presented and verified in a velocity measurement cell, in which the calculation results are in good agreement with the measured values. The model is used to examine the behaviour of fluid flow in an electroplating tank, especially in the vicinity of printed circuit board and shields. The influence of the shields on solution recirculation is analysed and discussed. The results indicate that solution recirculation could be improved when the eductors are arranged inclined to the printed circuit board.
