High temperature soldering of SiC particulate aluminium matrix composites (series 2000) using Zn–Al filler alloys

Abstract

The present paper evaluates the solderability of three discontinuously reinforced aluminium matrix composites. The tested composites were an aluminium alloy of the 2000 series (AA2014) reinforced with different percentages of silicon carbide particles (6, 13, and 20 vol.-% respectively). A similar study was carried out on the unreinforced aluminium alloy for comparative purposes. Three low temperature filler alloys of the Zn–Al system were used for soldering. Drop formation tests were performed to evaluate the wettability of the molten filler alloys and sample joints (single overlap specimens) were produced to determine solder penetration in the joint clearance. Microstructural studies of the joints were carried out to determine the effects of the solid reinforcement particles on molten pool behaviour and solidification mechanisms.