![Sample our Physical Sciences journals, sign in here to start your FREE access for 14 days]({"type":"image" , "src" : "/sda/110819/TOC-Subject-Sample-2021-Physical-Sciences.jpg"})
Abstract
Transient liquid phase (TLP) bonding of Al2024‐T6 alloy, using gallium (Ga) interlayer, has been investigated. Bonding process was carried out at 470°C for 6 min, and homogenising temperature and time were 495°C and 2 h respectively. Conventional TLP bonding using Ga interlayer was not an appropriate method for joining of Al2024. In this method, the boundary between two Al2024 specimens was not fully eliminated during bonding because of solidification with planar front. In addition, bonding zone was depleted of copper, and as a result, tensile and shear strength of joint decreased to 200 and 110 MPa respectively. TLP bonding under temperature gradient offered very good results in bonding of Al2024. In this method, solidification mechanism change from planar to dendritic, and tensile and shear strength of joint increased to about 460 and 220 MPa respectively. Microstructure of bonding zone changed basically by changing solidification mechanism.