Metal–metal bonding process using copper oxide nanoparticles

Abstract

This work performs metal–metal bonding using CuO nanoparticles prepared with salt base reaction in aqueous solution. A colloid solution of CuO nanoparticles was prepared by mixing Cu(NO₃)₂ aqueous solution and NaOH aqueous solution. Submicrometre sized leaf-like aggregates composed of CuO nanoparticles were produced at a Na/Cu ratio of 1·7 and at 20°C, though Cu₂(OH)₃NO₃ was also obtained. An aging process, which is a process composed of preparation of the particles at 20°C and then aging them at 80°C, provided transformation from Cu₂(OH)₃NO₃ to CuO with no damage of the leaf structure. The shear strength, which was required for separating discs bonded using the particles as a filler at 400°C in H₂ gas, was 32·5 MPa at the maximum for the particles prepared at the Na/Cu ratio of 1·7 with the aging process. These results indicated that the formation of leaf-like aggregates of CuO particles with high purity led to efficient metal–metal bonding.

Keywords:

• Copper oxide
• Nanoparticle
• Aggregate
• Salt base reaction
• Metal–metal bonding

This work was partially supported by Hitachi Ltd. We thank Professor T. Noguchi (College of Science, Ibaraki University, Japan) for his help in TEM observation.