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Abstract
TiCuN films were deposited onto M2 high speed steel substrates by arc ion plating. The effects of Cu content on the film structure and mechanical properties were evaluated. The influence of hollow cathode (HCD) current was examined with regard to elemental composition, structure, morphology and mechanical properties of the films. The microstructures of TiCuN films were characterised by X-ray diffraction, scanning electron microscopy and conventional mechanical probes. Hardness and adhesion forces of the film/substrate were determined using a nanoindenter (Agilent G200) and a multispecimen test system (CETR UNMT-1). The results showed that high hardness of the TiCuN films can be obtained only if the content of Cu did not exceed the value of 2–3%. With increased HCD current, the hardness of the films increased, reaching a maximum of 33 GPa at 100 A. The further increase in HCD current leads to an obvious decrease in the film thickness.
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Acknowledgments
The project is sponsored by the Foundation Research Funds for the Changchun University of Technology (No.2012LG11) and the Innovation Scientists and Technicians Troop Construction Projects of Changchun City (201305513KG39).